Common faults and solutions of clean ovens

The clean ovens are used for the pre-treatment baking of silicon chips, gallium arsenide, Lithium niobate, glass and other materials before gluing, curing of hard films after gluing and high-temperature baking after developing in semiconductor manufacturing; It is also suitable for production and research departments such as electronic liquid crystal displays, LCDs, CMOS, IS, pharmaceuticals, laboratories, etc; It can also be used for drying, heat treatment, aging, and other high-temperature tests of non volatile and non flammable and explosive materials.

Ⅰ、 Poor temperature uniformity

Reason:

1. Improper power allocation;

2. Electric heating component road robbery;

3. Improper construction of the furnace results in excessive heat dissipation;

4. The sealing of the furnace is not good, and all heat dissipation energy is too large;

5. Furnace with fan has uneven gas repetition or excess electricity;

6. The position of the thermocouple device or the depth of insertion cannot reflect the actual temperature;

7. Improper distribution of electric heating components;

8. The bottom temperature of the furnace is relatively low;

9. The heating power supply is out of phase and the safety Q wire is broken.

Handling method:

1. New plans to improve power configuration;

2. Replace the electric heating components of the road robbery;

3. Improve the structure of the furnace or improve the freezing method;

4. Review the sealing of the furnace to eliminate poor sealing elements;

5. Properly placing components to increase the power of the fan;

6. Legitimate selection of thermocouple device status or depth of insertion;

7. Mobilize the distribution of electric heating components;

8. Increase the heating power of the furnace bottom;

9. Review the heating power supply path.

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II、 Temperature control failure

Reason:

1. The temperature measuring tool is interfered with;

2. The thermocouple signal is interfered with;

3. Poor contact of thermocouples;

4. Make up for wire short circuits or road robberies;

5. The thermocouple is too close to the electric heating component;

6. Temperature control circuit malfunctions;

7. The thermocouple has been eroded and the electrical characteristics have undergone changes;

8. The insulation of the cover tube increases when the thermocouple is connected to the ground;

Handling method:

1. Take measures to eliminate sources of disturbance;

2. Increase barriers for signal lines;

3. Tighten the thermocouple reporting terminal;

4. Review and repair wires;

5. Adjust the gap between the two;

6. Training temperature control circuit;

7. Replace the thermocouple;

8. Review the insulation status of thermocouples;

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Ⅲ、 Low temperature display value

Reason:

1. The temperature of the thermocouple reference end is too high;

2. Thermocouple gate leakage;

3. Thermocouple gate decay;

4. The measurement position of thermocouples is too far;

5. Compensating for mismatches between wires and thermocouples;

6. Make up for the reverse connection between the wire and the thermoelectric dipole;

7. Compensate for increased wire insulation

Handling method:

1. Review the reference end temperature, which should comply with the request;

2. Review gate and relay connections;

3. Replace the thermocouple;

4. Mobilize the measurement position;

5. Replace the compensating wire;

6. Accurate connection and compensation of wires;

7. Replace the compensating wire;

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IV、 Temperature display equilibrium solid

Reason:

1. Poor contact of the thermocouple grid;

2. Intermittent short circuit or road robbery of thermocouples;

3. Thermocouples have intermittent grounding;

4. The status of thermocouples has been constantly changing;

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