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IEC 61189-2-721电气材料、印制板和其他互连结构和组件的试验方法。第2-721部分

2022-04-27 15:27 作者:中科易朔CASfire  | 我要投稿

标准名称

IEC 61189-2-721 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

IEC 61189-2-721电气材料、印制板和其他互连结构和组件的试验方法。第2-721部分:互连结构材料的试验方法。使用分离后介质谐振器在微波频率下对覆铜板的相对介电常数和损耗正切的测量

 

适用范围

Scope:

This part of IEC 61 1 89 outlines a way to determine the relative permittivity ( ε r ) and loss tangent (tan δ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1 ,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).

 

出自GF2022


IEC 61189-2-721电气材料、印制板和其他互连结构和组件的试验方法。第2-721部分的评论 (共 条)

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