ICS T8461 对HIU电路的逻辑功率进行调节

HIU是模块的模块间总线（IMB）的接入点。它还提供

功率分配和本地可编程处理功率。HIU是

I/O模块直接连接到IMB背板。HIU对于大多数高

完整性I/O类型，并具有类型相关和产品范围通用功能。每个HIU

包含三个独立的切片，通常称为A、B和C。

三个切片之间的所有互连都包含隔离，有助于防止任何故障

切片之间的相互作用。每个切片都被视为故障控制区（FCR），如下所示

一个切片上的故障对其他切片的操作没有影响。

HIU为系列中的模块提供以下通用服务：

•通过IMB与TMR处理器进行高速容错通信

界面

•切片之间的FCR互连总线，用于对传入的IMB数据进行投票和分发

输出I/O模块数据到IMB。

•与FIU切片的电隔离串行数据接口。

•双24 Vdc机箱电源电压和电源的冗余电源共享

对HIU电路的逻辑功率进行调节。

•FIU切片的磁隔离电源。

•模块状态LED的FPU串行数据接口。

•活动模块和备用模块之间的SmartSlot链接，用于在

模块更换。

•数字信号处理，用于执行本地数据减少和自我诊断。

•用于存储模块操作、配置和现场I/O的本地内存资源

数据

•车载内务管理，监控参考电压、电流消耗

和板温度。

The HIU is the point of access to the Inter-Module Bus (IMB) for the Module. It also provides

power distribution and local programmable processing power. The HIU is the only section of

the I/O Module to directly connect to the IMB Backplane. The HIU is common to most high

integrity I/O types and has type dependent and product range common functions. Each HIU

contains three independent slices, commonly referred to as A, B, and C.

All interconnections between the three slices incorporate isolation to help prevent any fault

interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as

a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the Modules in the family:

• High Speed Fault Tolerant Communications with the TMR Processor via the IMB

interface.

• FCR Interconnect Bus between slices to vote incoming IMB data and distribute

outgoing I/O Module data to the IMB.

• Galvanically isolated serial data interface to the FIU slices.

• Redundant power sharing of dual 24 Vdc chassis supply voltage and power

regulation for logic power to HIU circuitry.

• Magnetically isolated power to the FIU slices.

• Serial data interface to the FPU for Module status LEDs.

• SmartSlot link between Active and Standby Modules for co-ordination during

Module replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing Module operation, configuration, and field I/O

data.

• On-board housekeeping, which monitors reference voltages, current consumption

and board temperature.